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Curing in thermal analysis
Solid materials that are processed in a liquid aggregate state generally require a certain amount of time to harden. During this time, chemical and physical processes take place that lead to the solidification of the material. These processes, explained by our sales expert Heinz Renner, are associated with the release or absorption of heat and can be observed as part of differential scanning calorimetry (DSC) and dielectric analysis (DEA).
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Speakers

Heinz Renner
Sales Expert @Linseis Messgeräte GmbH